 |
|
|
| |
|
|
|
|
|
|
- (8)
- (1)
- (1)
- (1)
- (1)
- (11)
- (7)
- (1)
- (1)
- (1)
- (7)
- (3)
- (1)
- (2)
- (1)
- (6)
- (5)
- (1)
- (1)
- (1)
|
|
| |
|
|
Build Your Online Product Catalogs?
| Product Name: |
Flip chip bonding machine
|
| Supply Ability: |
100000 |
| Related proudcts |
bonding machine, |
| Specifications |
standard |
| Price Term: |
FOB |
| Port of loading: |
SHENZHEN |
| Minimum Order |
1 |
| Unit Price: |
|
|
| The flip chip bonding machine is mainly used in the flip welding process of large-scale integrated circuit device manufacturing to complete the flip interconnection between chip and substrate, so that the package has better circuit characteristics of high frequency, low delay and low crosstalk, and can effectively improve the reliability of assembly and interconnection of circuit, component or system. |
| Company: |
Chongqing Nord Electric Technology Co., Ltd.
|
| Contact: |
Mr. xiaolin xu |
| Address: |
1-6-3, No.511 Gongnong North Road, Dianjiang County, Chongqing, China |
| Postcode: |
|
| Tel: |
86-183-25030355 |
| Fax: |
|
| E-mail: |
|
|
|
Home
